Testing and programing

ICT test : Marconi (Aeroflex) IFR4219

 2048 test points available

An inductive and capacity vector test

Capacitor polarity test

Programming of ISP and FLASH

Used ATX testing and programming adapters 

Tester izolací: Surge tester GW Instek GPT-9802

Testing of isolation using pre-adjustable voltage. Testing output 200 VA

Isolation resistance (max.) : 9500 MΩ

Voltage measurement range : AC test with voltage 0.1 to 5 kV, max. 40 mA

Voltage measurement range : DC test with voltage 0.1 to 6 kV, max. 10 mA

Generátor přepětí (Surge generátor) Lisun SG 61000

Scope of output voltage: 0~4.8KV±10%

Output impedance: 2Ω and 12Ω

Pulse duration: 1.2 / 50μs ± 20%

Output current: 0-2.4KA ± 10%

Univerzální programátor: Xeltek SUPERPRO 611S

Supported devices : EPROM, paginated EPROM, parallel and series EEPROM, configuration FPGA PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, firmware HUB, microcontroller, MCU

Support of cases (with the use of adapters):

DIP, SDIP, PLCC, JLCC, PGA, LGA, SOIC, SOJ, SOT, QFP, TQFP, PQFP, VQFP, MQFP, LQFP, TSOP, SOP, TSOPII, PSOP, SSOP, TSSOP, SON, EBGA, FBGA, FTBGA, VFBGA, µBGA, CSP, SCSP, QFN, HVQFN

Full-HD mikroskop Visus CMORE Plus

Resolution: 1920×1080 (Full HD)

Zoom: x20 – optical

Lighting: two inbuilt LED lights

Clearance under the lens: 280 mm

Full-HD mikroskop Inspex HD 1080p

Resolution: 1920×1080 (Full HD)

Zoom: 2x-51x – optical

Illumination: adjustable LED

Clearance under the lens: 250 mm

Simple taking and exporting pictures

Saving of images via USB

Opravárenské pracoviště Martin EXPERT 10.6

For repairs of BGA, CSP, SO and QFN and other types of SMD.

A semiautomatic hybrid rework system

All soldering profiles and configurations in the repair process are controlled clearly and easily by software.

Heating from below (hybrid): 600 W – 3 000 W.

Heating from the top (hot air): 300 W.

PCB size (max): 300 x 300 mm.

Total basic area: 865 x 460 mm2.

Resolution of the movement system: 0.001 mm.

Placement accuracy: ± 0.015 mm (flip chips),      ± 0.030 mm (CSP), ± 0.040 mm (BGA), ± 0.70

Rentgen Glenbrook Technologies

2D X-ray inspections of mounted boards; especially inspections of BGA chips soldering 

The tube can be turned by 45° 

Magnification: 4 – 20x

Output of X-ray tube: 20 kV to 70 kV

A simple software with intuitive operation

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