External Hyfra Sigma 13-S-P cooling for the new oven

ILV adds external Hyfra Sigma 13-S-P cooling to the new SMT oven

ILV has expanded the technological setup of its 2nd SMT line with external cooling Hyfra Sigma 13-S-P, designed for the new SMT Thermal Discoveries oven. The unit is installed and is currently running in a test mode prior to being put into standard operation.

The aim is to support stable conditions of the soldering (reflow) process and thereby ensure consistent quality of printed circuit board (PCB) assembly across production series.